JPH01171065U - - Google Patents
Info
- Publication number
- JPH01171065U JPH01171065U JP6788088U JP6788088U JPH01171065U JP H01171065 U JPH01171065 U JP H01171065U JP 6788088 U JP6788088 U JP 6788088U JP 6788088 U JP6788088 U JP 6788088U JP H01171065 U JPH01171065 U JP H01171065U
- Authority
- JP
- Japan
- Prior art keywords
- solder plating
- integrated circuit
- hybrid integrated
- plating layer
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6788088U JPH01171065U (en]) | 1988-05-23 | 1988-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6788088U JPH01171065U (en]) | 1988-05-23 | 1988-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171065U true JPH01171065U (en]) | 1989-12-04 |
Family
ID=31293223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6788088U Pending JPH01171065U (en]) | 1988-05-23 | 1988-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171065U (en]) |
-
1988
- 1988-05-23 JP JP6788088U patent/JPH01171065U/ja active Pending